Single Wafer

  • Etching
  • Cleaning
  • Stripping
  • Metal Lfit Off
  • Ozone Processes
  • Wafers or Masks
  • Manual loading or fully automatic handling options
  • Single or dual chamber configurations
  • 2″ – 12″ wafers or masks
  • Programmable media arm(s)
  • Polymer construction for acid/bases or stainless steel for solvent
  • Multiple chuck designs and easy change out
  • Pressurized or pump chemical delivery systems
  • Several nozzle options (fan spray, puddle, high pressure)
  • Heated chemical up to 80°C
  • Touch screen interface

Alteration right reservation to introduce improvements

Further Information after request

  • Digital flow monitoring
  • Ozone generator and diffuser
  • Chemical recycling
  • Non-contact chucks
  • High pressure spray (up to 3.000psi)
  • Handling automation
  • Up to 6 media nozzles
Download