HF Etching

  • Etching
  • Cleaning
  • Manual loading or fully automatic handling options
  • Single or dual chamber configurations
  • 2″ – 8″ wafers or masks
  • Etching side (front / back) selectable in recipe
  • One-sided etching without backside masking
  • Programmable handling arm(s)
  • Polymer construction for acid / bases or stainless steel for solvent
  • Multiple chuck designs and easy change out
  • Touch screen interface

Alteration right reservation to introduce improvements

Further Information after request

  • Quick change adapter for small substrates
  • Multi-chuck for multiple wafer sizes
  • Vacuum handling arm for individual substrate geometries