PLATING STAR® – electroless

This fully automatic production plant was manufactured for the electroless nickel bumping process and is suitable for 2” to 8” wafers in carrier.

From “mini“-automatic equipment with 2 stations or more to large production equipment with any amount of stations.

The wafer bumping plant can also be manufactured as a manual or semi-automated plant.

Alteration right reservation to introduce improvements

  • Modular design
  • Convertible for 4“, 6“, 8“, 12“
  • Carrier
  • Filtration with Recirculation
  • Process data collection
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