Since 1972, company RAMGRABER is successfully working in the production of plating systems for the electronics industry. Over the course of the ensuing decades, we have been continually expanding our knowledge in the field of galvanic processes.

You can also benefit from the advantage we offer your – our extensive experience in electroplating of semiconductors, electronics components, solar cells and microsystems.

Thanks to close cooperation with leading research institutes and our customers, we are able to offer you solution-oriented support when optimizing your processes.

Plating: Overview

Substrate Types Si, III-V-semiconductor, ceramic, metal, glass
round or square
Plating Materials Ag, Au, Cu, Pd, Ni, Sn, AuSn, PbSn, NiCo etc.
Plater Types Rack, Fountain
Substrate Arrangement vertical, horizontal, oblique
Substrate Holder single holder
multiple holder
sealing of the backside
sealing around the contact areas
Electrical Contact front- or backside
isolated or free
Electrolyte Flow towards Substrate through the line of force shield
flow parts in motion
Movement horizontal, vertical
Rotation, oscillation
Electrolyte Preparation heating and cooling
dosing systems
selective cleaning
Tank Material PP – welded or deep drawn
PVDF – welded or deep drawn
high-grade steel – with anodic protection
Protective Gas Atmosphere for fast oxidizing electrolytes
Heating and Cooling direct or indirect heating
PTFE or PFA coated
quartz heater
radiation heater
large area heater to avoid overheating
Measuring current / voltage
filling level
flow rate
concentration via absorption or
Power Supply high exactness
minor ripple
pulse plating
Automation Level manual, semi-automatic, fully automatic
Quality of Process Area up to class 10
integrated laminar flow box
optimized air flow in the process area
Handling Systeme Two-axis handler, roboter
In-Output-Carrier standard oder special carrier
single substrate
Control System switchgear
Industry PC
Touch Screen
visualisation systems
Identification System Transponder,
Software solutions on customer requirements
Pre- and After-Treatment Processes rinse, clean, etch, dry, reflow

RAMGRABER systems convince through:

  • Homogeneous  plating
  • Reproducibility
  • Ideal  shield technique
  • Cost effective Design
  • High-quality components
  • High throughput rates
  • longevity
  • High maintainability
  • Our competent service

[Translate to Englisch:] Produktgalerie